On overtravel and skate in cantilever-based probes for on-wafer measurements

Abstract Due to the deformability of a microcantilever-based probe, there is an interesting and subtle interplay between probe overtravel, tip skate on surface, ultimate tangency with wafer surface. The relationship these parameters described here. scalable model tested using macroscopic cantilever found be accurate in its predictions. In addition, avoid potential skate-induced damage metallisation, idea zero-skate cantilever-based has been introduced; minimal demonstrated cantilever—the can reduced by factor 0.176. As scalable, this information could use designer emerging miniature microelectromechanical systems (MEMS) surface contact probes destined for on-wafer electrical measurements or test engineer concerned contacting—where overtravel are important practical concerns having repercussions quality. Some predictions modelling provided.